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PCB trace width calculator

Find the minimum trace width for a current, or the current an existing trace can carry, using the IPC-2221 formula. It also gives resistance, voltage drop and power loss, for outer and inner layers, in mm or mil.

Calculate
Units
A
°C

How much hotter than ambient the trace may run. 10 °C is a common, conservative choice.

°C
Layer
mm

Adds resistance, voltage drop and power loss.

Minimum trace width

0.3 mm

11.8 mil · IPC-2221, 1 oz copper, 10 °C rise

Current
1 A
Cross-section
16.3 mil²
Trace temperature
35 °C
Same current, inner layer
0.781 mm (30.8 mil)
Resistance
86.8 mΩ
Voltage drop
86.8 mV
Power loss
86.8 mW

How wide should a PCB trace be?

For 1 A on 1 oz copper with a 10 °C temperature rise, IPC-2221 gives 0.3 mm (11.8 mil) on an outer layer and 0.781 mm (30.8 mil) on an inner layer. Width grows faster than current: 5 A needs about 2.77 mm and 10 A about 7.19 mm on an outer layer. Round up, and use heavier copper or a pour for high currents.

How to use the trace width calculator

  1. Choose whether you want the width for a current or the current for a width.
  2. Enter the current (or width), the copper weight of the layer, and the temperature rise you can accept.
  3. Pick an outer or inner layer. Inner layers need much wider traces for the same current.
  4. Add the trace length if you also want its resistance, voltage drop and power loss.

The result is the narrowest trace that stays within your temperature rise. Round it up to a value your fab and layout grid like, and leave margin on traces that carry power for long periods. Switch between mm and mil at any time; the calculator keeps the physical size.

How to calculate PCB trace width with IPC-2221

IPC-2221 relates current to the copper cross-section of the trace and the temperature rise it causes:

I = k × ΔT0.44 × A0.725

Here I is the current in amps, ΔT the temperature rise in °C, and A the cross-sectional area in square mils. The constant k is 0.048 for outer layers and 0.024 for inner layers. To get a width, solve for the area, A = (I ÷ (k × ΔT0.44))1/0.725, then divide by the copper thickness: 1 oz/ft² copper is about 35 µm (1.38 mil) thick.

Worked example 1: 1 A on an outer layer

A = (1 ÷ (0.048 × 100.44))1/0.725 ≈ 16.3 mil². With 1 oz copper that is 16.3 ÷ 1.38 ≈ 11.8 mil, or about 0.30 mm.

Worked example 2: 5 A on an inner layer with 2 oz copper and a 20 °C rise

With k = 0.024, A = (5 ÷ (0.024 × 200.44))1/0.725. 2 oz copper is 2.76 mil thick, so the width comes out at 2.36 mm (93 mil). The same current on an outer layer would need only 0.908 mm (35.7 mil).

Worked example 3: how much current a 0.5 mm trace carries

Run the formula forwards. A 0.5 mm (19.7 mil) trace in 1 oz copper has A ≈ 27.1 mil², so on an outer layer with a 10 °C rise it carries I = 0.048 × 100.44 × 27.10.725 ≈ 1.45 A.

PCB trace width vs current chart

1 oz copper, 10 °C temperature rise, IPC-2221. Widths over 400 mil (10.2 mm) are beyond the IPC-2221 chart and are extrapolated; at those currents use heavier copper or a pour.

CurrentOuter layerInner layer
0.25 A0.0444 mm (1.75 mil)0.115 mm (4.55 mil)
0.5 A0.115 mm (4.55 mil)0.3 mm (11.8 mil)
1 A0.3 mm (11.8 mil)0.781 mm (30.8 mil)
1.5 A0.525 mm (20.7 mil)1.37 mm (53.8 mil)
2 A0.781 mm (30.8 mil)2.03 mm (80 mil)
3 A1.37 mm (53.8 mil)3.56 mm (140 mil)
4 A2.03 mm (80 mil)5.29 mm (208 mil)
5 A2.77 mm (109 mil)7.19 mm (283 mil)
7.5 A4.84 mm (190 mil)12.6 mm (495 mil)
10 A7.19 mm (283 mil)18.7 mm (737 mil)
15 A12.6 mm (495 mil)32.7 mm (1290 mil)
20 A18.7 mm (737 mil)48.7 mm (1920 mil)
25 A25.5 mm (1000 mil)66.2 mm (2610 mil)
30 A32.7 mm (1290 mil)85.2 mm (3350 mil)
PCB trace width versus current, IPC-2221Minimum trace width in millimetres for currents from 0 to 20 A with 1 oz copper and a 10 °C temperature rise. Inner layers need about 2.6 times the width of outer layers.04812160 A5 A10 A15 A20 AWidth (mm)Outer layerInner layer
IPC-2221, 1 oz copper, 10 °C rise. The inner-layer curve leaves the chart near 8.9 A. Exact values are in the table above.

Trace width for 5 A, 10 A, 15 A and 20 A

Outer layer, 10 °C rise, by copper weight. High currents are where heavier copper pays for itself.

Current0.5 oz copper1 oz copper2 oz copper3 oz copper
5 A5.53 mm (218 mil)2.77 mm (109 mil)1.38 mm (54.4 mil)0.922 mm (36.3 mil)
10 A14.4 mm (566 mil)7.19 mm (283 mil)3.6 mm (142 mil)2.4 mm (94.4 mil)
15 A25.2 mm (991 mil)12.6 mm (495 mil)6.29 mm (248 mil)4.2 mm (165 mil)
20 A37.4 mm (1470 mil)18.7 mm (737 mil)9.36 mm (368 mil)6.24 mm (246 mil)

PCB trace current capacity by width

Maximum current for common trace widths, 1 oz copper, 10 °C rise, IPC-2221.

Trace widthOuter layerInner layer
6 mil (0.152 mm)0.611 A0.306 A
8 mil (0.203 mm)0.753 A0.377 A
10 mil (0.254 mm)0.885 A0.443 A
12 mil (0.305 mm)1.01 A0.505 A
15 mil (0.381 mm)1.19 A0.594 A
20 mil (0.508 mm)1.46 A0.732 A
25 mil (0.635 mm)1.72 A0.86 A
30 mil (0.762 mm)1.96 A0.982 A
40 mil (1.02 mm)2.42 A1.21 A
50 mil (1.27 mm)2.84 A1.42 A
75 mil (1.91 mm)3.82 A1.91 A
100 mil (2.54 mm)4.7 A2.35 A

How temperature rise changes the width

2 A on an outer layer with 1 oz copper. Allowing more heat buys a narrower trace, with diminishing returns.

Temperature riseMinimum width
5 °C1.19 mm (46.9 mil)
10 °C0.781 mm (30.8 mil)
20 °C0.513 mm (20.2 mil)
30 °C0.401 mm (15.8 mil)
45 °C0.314 mm (12.3 mil)
60 °C0.263 mm (10.4 mil)

Copper weight, thickness and resistance

Copper weightThicknessSheet resistance at 25 °CWidth for 2 A, outer, 10 °C rise
0.5 oz/ft²17.5 µm (0.689 mil)1 mΩ per square1.56 mm (61.5 mil)
1 oz/ft²35 µm (1.38 mil)0.502 mΩ per square0.781 mm (30.8 mil)
2 oz/ft²70 µm (2.76 mil)0.251 mΩ per square0.391 mm (15.4 mil)
3 oz/ft²105 µm (4.13 mil)0.167 mΩ per square0.26 mm (10.3 mil)

Common scenarios

Minimum IPC-2221 widths for everyday power paths, with the voltage drop and loss over the stated length at the trace's operating temperature (25 °C ambient plus the rise).

ScenarioLayer and copperMinimum widthDrop and loss
USB-C 5 V at 3 A input
The common USB-C default-power ceiling. Keep VBUS short and wide from the connector to the input capacitor.
Outer, 1 oz, 10 °C rise1.37 mm (53.8 mil)46 mV and 140 mW over 40 mm
USB Power Delivery 20 V at 5 A (100 W)
Most designs use a copper pour for this path rather than a single trace; the width is the floor, not the target.
Outer, 1 oz, 10 °C rise2.77 mm (109 mil)38 mV and 190 mW over 40 mm
12 V LED strip feed at 2 A
Longer runs matter more for voltage drop than for heat at this current.
Outer, 1 oz, 10 °C rise0.781 mm (30.8 mil)130 mV and 270 mW over 100 mm
Raspberry Pi 5 V at 5 A supply
A 5 V rail cannot afford much drop: compare the voltage drop with the board’s undervoltage threshold.
Outer, 1 oz, 10 °C rise2.77 mm (109 mil)28 mV and 140 mW over 30 mm
ESP32 3.3 V rail at 0.5 A
Wi-Fi transmit bursts reach a few hundred milliamps; size for the peak and add bulk capacitance near the module.
Outer, 1 oz, 10 °C rise0.115 mm (4.55 mil)68 mV and 34 mW over 30 mm
1S Li-ion charger at 2 A
Battery traces carry current continuously while charging, so stay at a conservative rise.
Outer, 1 oz, 10 °C rise0.781 mm (30.8 mil)33 mV and 67 mW over 25 mm
24 V motor driver at 10 A, 2 oz copper
Heavier copper and a 20 °C rise are typical for power stages with airflow or a heatsink nearby.
Outer, 2 oz, 20 °C rise2.36 mm (93 mil)57 mV and 570 mW over 50 mm
Inner-layer 3.3 V distribution at 1 A
Inner layers on many 4-layer stackups are 0.5 oz, which pushes the width up quickly; a plane is often simpler.
Inner, 0.5 oz, 10 °C rise1.56 mm (61.5 mil)40 mV and 40 mW over 60 mm

Trace resistance and voltage drop

Heat is only half the story. A trace that is thermally fine can still drop too much voltage, especially on low-voltage rails. Copper's resistivity is 1.724 × 10-8 Ω·m at 20 °C and rises by about 0.393 % per °C, so a trace running 10 °C above a 25 °C ambient has roughly 6 % more resistance than at room temperature.

The quickest way to estimate resistance is to count squares. A trace's resistance is its sheet resistance times length ÷ width. 1 oz copper is about 0.5 mΩ per square at 25 °C, so a 10 mil × 1 inch trace is 100 squares, or about 50 mΩ. At 2 A that is about 100 mV of drop, which is fine for 12 V and noticeable on a 1.0 V core rail.

Design guidelines and common mistakes

  • Round up. A trace a little wider than the minimum costs nothing and buys margin for etch and copper tolerance.
  • For several amps, use a copper pour or polygon instead of a single trace, and keep the path short.
  • When a high-current path changes layer, use several vias. One small via can carry far less than the trace feeding it; check with the via current calculator.
  • Check the voltage drop as well as the temperature: a long, thin supply trace can drop more than your regulator's headroom.
  • Size for the worst sustained current, not the typical one. Motor stall, inrush and fault currents matter.
  • Do not use the inner-layer result for a trace on the top or bottom, or the other way round. The factor is about 2.6.
  • Don't forget the bottleneck: a wide trace that necks down into a narrow connector pin or a thermal-relief spoke is only as good as its narrowest point.
  • Stay at or above your fab's minimum trace width. Many fabs list about 0.1 to 0.127 mm (4 to 5 mil) as standard, so check yours. For the full set of rules, see the PCB design rules guide.

IPC-2221 vs IPC-2152, and where this calculator stops

Outer-layer traces lose heat to the air, while inner traces are wrapped in laminate. That is why IPC-2221 asks for roughly 2.6 times the width on an inner layer for the same current. The newer IPC-2152 standard, built from more measurements, shows that IPC-2221 is conservative for inner layers, and that copper planes near a trace and a thicker board both help it run cooler. If you are tight on space, IPC-2152 charts can justify narrower inner traces; if you have room, the IPC-2221 width is the safe choice.

The IPC-2221 curves were drawn for currents up to 35 A, widths up to 400 mil and temperature rises from 10 to 100 °C. Outside that range the calculator warns you, because the result is an extrapolation. It also assumes an isolated trace carrying steady DC: neighbouring hot traces, enclosed boards, high ambient temperatures and high-frequency AC all change the picture, and a thermal simulation or a measured prototype is the final word.

Trace width for impedance and RF

Current is not the only reason to pick a width. High-speed and RF traces are sized for a characteristic impedance such as 50 Ω single-ended or 90 to 100 Ω differential, which depends on the trace width, copper thickness, dielectric height and material. Those widths are usually far narrower than any current limit, so size controlled-impedance traces with the PCB impedance calculator and use this page for power.

Do this automatically in ProtoFlow

In the ProtoFlow desktop app, current is a property of the net class rather than a number you look up. Set a target current on a class such as Power, and Board Setup computes the IPC-2221 width from the copper weights in your stackup, rounds it up and flags any class whose trace width cannot carry its current. The autorouter then routes each net at its class width, so the 3 A input and the 50 mA sensor line come out right without you sizing them by hand. You can start from a plain-English description of the board, let the AI draft the schematic and layout, and refine from there. Download ProtoFlow free for macOS, Windows or Linux.

Glossary

Trace width
The width of a copper track on a PCB layer, usually given in mm or mil.
Copper weight
Copper thickness expressed as ounces per square foot. 1 oz/ft² is about 35 µm (1.38 mil) thick.
Temperature rise (ΔT)
How much hotter than the surrounding board and air a trace runs while carrying its current.
Cross-sectional area
Width times copper thickness. IPC-2221 expresses it in square mils.
Ampacity
The current a conductor can carry continuously without exceeding a chosen temperature rise.
Outer (external) layer
The top or bottom copper layer, exposed to air through the solder mask, so it cools better.
Inner (internal) layer
A copper layer buried inside the laminate of a multilayer board. It cools worse than an outer layer.
IPC-2221
The IPC generic standard on printed board design. Its current-capacity chart is the basis of the formula used here.
IPC-2152
A newer IPC standard dedicated to current-carrying capacity, built from more extensive measurements.
Sheet resistance
Resistance of a square of copper of any size, in ohms per square. It depends only on thickness and temperature.
Voltage drop
The voltage lost along a trace, equal to current times trace resistance.
Net class
A group of nets that share routing rules such as trace width, clearance and via size.
Mil
One thousandth of an inch, 0.0254 mm. Not a millimetre.

Related guides

Frequently asked questions

How wide should a PCB trace be for 1 A?

With 1 oz copper and a 10 °C temperature rise, IPC-2221 gives about 0.3 mm (11.8 mil) on an outer layer and 0.781 mm (30.8 mil) on an inner layer. Many designers round up to 0.4 to 0.5 mm on outer layers for margin.

What trace width do I need for 5 A or 10 A?

On an outer layer with 1 oz copper and a 10 °C rise, 5 A needs about 2.77 mm (109 mil) and 10 A needs about 7.19 mm (283 mil). At these currents most boards use 2 oz copper, a copper pour, or both, and accept a 20 °C rise where the design allows it.

How much current can a 10 mil trace carry?

A 10 mil (0.254 mm) trace in 1 oz copper carries about 0.89 A on an outer layer and about 0.44 A on an inner layer for a 10 °C rise, according to IPC-2221.

How do I calculate PCB trace width?

Use the IPC-2221 equation I = k × ΔT^0.44 × A^0.725. Solve it for the cross-sectional area A in square mils, A = (I ÷ (k × ΔT^0.44))^(1/0.725), with k = 0.048 for outer layers and 0.024 for inner layers, then divide the area by the copper thickness (1.38 mil for 1 oz copper) to get the width.

Why do inner layers need wider traces?

Outer-layer traces shed heat into the air; inner traces are buried in FR-4, which insulates them. IPC-2221 models this by halving the constant k (0.024 instead of 0.048), which means about 2.6 times the cross-section for the same current and temperature rise.

What temperature rise should I use?

A 10 °C rise is the common conservative default. 20 °C is often acceptable for power traces on boards with thermal headroom. Use a lower rise when the board runs near its maximum operating temperature or sits in a sealed enclosure.

Is IPC-2221 or IPC-2152 more accurate?

IPC-2152 is newer and based on more extensive testing, and it usually allows narrower inner-layer traces than IPC-2221. IPC-2221 remains the widely used closed-form formula, and because it is conservative for inner layers, a width that passes IPC-2221 is a safe starting point.

Does copper weight change the trace width?

Yes. The formula works on cross-sectional area, so doubling the copper weight from 1 oz to 2 oz halves the width needed for the same current. Heavier copper costs more and limits how fine your other traces can be.

Does this calculator work for AC or pulsed current?

It assumes steady DC. For AC, use the RMS current. Short pulses heat a trace less than the steady-state result suggests, but high-frequency current also crowds toward the surface (skin effect), so treat the result as a starting point.

How do I calculate trace resistance and voltage drop?

Resistance is ρL ÷ (w × t), with copper resistivity ρ = 1.724 × 10⁻⁸ Ω·m at 20 °C rising about 0.393 % per °C. A handy shortcut is sheet resistance: 1 oz copper is about 0.5 mΩ per square at 25 °C, so count length ÷ width squares and multiply. Voltage drop is current × resistance.

Does KiCad have a trace width calculator?

Yes. KiCad’s PCB Calculator includes a track width tool based on the same IPC-2221 equation. This page gives the same result in the browser, plus resistance, voltage drop and ready-made tables, and ProtoFlow applies it automatically to net classes.

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