K4F6E3S4HM-MGCJ
by SAMSUNG(三星半导体)
A 200-pad FBGA footprint defines the board connection pattern for Samsung's K4F6E3S4HM-MGCJ DRAM memory IC. DRAM provides working memory for processor-based systems, with its interface connections represented here by a 200-pin schematic symbol. The free KiCad download pairs that symbol with FBGA-200_L15.0-W10.0-BL_K4F6E3S4HM and includes a 3D model for the surface-mount package. Having both schematic and board assets makes the memory's connections and physical placement available within the same design workflow. Use of the conversion by 1 ProtoFlow engineer in real designs provides its practical verification history. Open the memory component directly in ProtoFlow to work with the supplied assets.
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