K4U6E3S4AA-MGCL
by SAMSUNG(三星半导体)
Samsung K4U6E3S4AA-MGCL is a mobile DRAM device for systems requiring dense working memory close to a processor or SoC. Its fine-pitch ball-grid package supports the numerous data, address, control, power, and ground connections involved in a high-density memory interface. The downloadable library contains a 200-pin schematic symbol and the 200-pad FBGA-200_L15.0-W10.0-BL_K4F6E3S4HM footprint. An accompanying 3D model provides a useful visual reference for package placement and board-level mechanical review. The conversion has been incorporated into real designs by 2 ProtoFlow engineers, adding practical verification to the imported symbol and land pattern. This memory component can be opened directly in ProtoFlow to begin schematic integration and PCB escape planning.
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