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KICAD DRC

KiCad "Thermal relief connection to zone incomplete" (starved thermal)

KiCad design rule check (PCB) message: Thermal relief connection to zone incomplete (starved_thermal in kicad-cli reports).

What it means

A pad connected to a pour with thermal reliefs needs a minimum number of spokes reaching the zone (two by default). KiCad reports this warning when fewer spokes actually make it, usually because a nearby track, via or the board edge blocks the others. The pad may still be connected, but through a thin path that can heat up or fail.

Common causes

  • Vias, tracks or other pads sitting where the spokes would go.
  • A thermal gap or spoke width that is too large for the space around the pad.
  • The pad sitting near the edge of the pour, so some spokes have nowhere to land.

How to fix it

  1. Move the obstacle, or rotate the footprint so the spokes have room.
  2. Reduce the thermal relief gap or widen the spokes in the zone properties (or per pad in the footprint).
  3. Switch that pad to a solid connection if it does not need thermal relief for soldering.
  4. Lower the zone's minimum spoke count only if one spoke really carries enough current.

Where the setting lives

Zone Properties → thermal relief gap, spoke width and minimum spoke count; pad properties → zone connection.

Good to know

KiCad counts a track that leaves the pad and ends inside the fill as a spoke, so a short track into the pour can satisfy the check.

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Checked against KiCad 10's source and documentation. Last reviewed 2026-11-07.

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