TPSM86838RCGR
by TI(德州仪器)
For a power-supply layout using TI's TPSM86838RCGR, the package connection pattern is a consequential part of the design. This surface-mount power module uses a 19-connection QFN-style footprint with an exposed-pad designation in its footprint name. The downloadable KiCad set contains a 19-pin symbol, the 19-pad QFN-19_L5.5-W5.0-P0.50-TL-EP_TPSM86838RCGR footprint, and a 3D model. Those files let the schematic and board use the same imported part definition. A ProtoFlow engineer has used this conversion in real designs, with 1 engineer recorded. The part opens directly in ProtoFlow.
Download KiCad files
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