MAX77650AEWV+T

by ADI(亚德诺)/MAXIM(美信)

For a compact power-management design, the ADI/Maxim MAX77650AEWV+T provides an integrated power IC rather than a collection of separate schematic blocks. The package in this record is a 30-contact wafer-level package, so the PCB land pattern matters as much as the schematic connections. Its downloadable KiCad set contains a 30-pin symbol, the WLP-30_L2.7-W2.1-R5-C6-P0.40-BL footprint with 30 pads, and a 3D model to inspect the assembled layout. The exact footprint name is useful when reviewing the board against the selected package variant. The files originated in a real ProtoFlow import and were converted and checked in the editor. Open the part directly in ProtoFlow to inspect it there.