H9HCNNN8KUMLHR-NME
by HYNIX(海力士)
The 200-pad BGA footprint is a defining layout consideration for HYNIX H9HCNNN8KUMLHR-NME, a memory IC used to provide working memory in processor-based systems. Its surface-mount ball-grid package places the connections beneath the device body. The free KiCad library pairs a 200-pin symbol with BGA-200_L15.0-W10.0_H9HCNNN8KUMLHR-N, the matching 200-pad footprint, and includes a 3D model for assembly visualization. Real-design use by 3 ProtoFlow engineers supports the conversion's verification history. This entry brings the schematic and physical representations together for memory integration work. It is available to open directly in ProtoFlow.
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