ESIM_贴片移动SIM卡
An embedded SIM gives a cellular design a soldered SIM component on the PCB. The ESIM_贴片移动SIM卡 part, also labeled ESIM_MFF2, uses a surface-mount DFN package with an exposed pad. Its downloadable library includes a 9-pin KiCad symbol, the DFN-8_L6.0-W5.0-P1.27-BL-EP-A footprint with 9 pads, and a 3D model for viewing the component in the board assembly. Verification includes this conversion's use by 2 ProtoFlow engineers in real designs. Open this SIM part directly in ProtoFlow for integration into the cellular section of a board.
Download KiCad files
Use ESIM_贴片移动SIM卡 in your design
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