TI_SO-PowerPAD-8_ThermalVias
Free PCB footprint for TI_SO-PowerPAD-8_ThermalVias — 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf. Preview it below, download the KiCad files, or open it straight in ProtoFlow.
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