Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm
Free PCB footprint for Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm — Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf. Preview it below, download the KiCad files, or open it straight in ProtoFlow.
Use Nexperia_WLCSP-15_2.37x1.17mm_Layout6x3_P0.4mmP0.8mm in your design
ProtoFlow is a free, AI-native EDA tool — drop this part onto a schematic, route a PCB, and let the AI copilot help. The symbol, footprint, and 3D model come in linked and ready.
Free to start • macOS, Windows & Linux • No sign-up to try
More from Package_CSP
WLCSP-8_1.58x1.63x0.35mm_Layout3x5_P0.35x0.4mm_Ball0.25mm_Pad0.25mm_NSMDST_WLCSP-49_3.15x3.13mm_Layout7x7_P0.4mmLFCSP-56-1EP_8x8mm_P0.5mm_EP6.6x6.6mmLFCSP-8-1EP_3x3mm_P0.5mm_EP1.6x2.34mmST_WLCSP-20_1.94x2.4mm_Layout4x5_P0.4mmDialog_WLCSP-34_4.54x1.66mm_Layout17x4_P0.25x0.34mmOnSemi_ODCSP8_BGA-8_3.16x3.16mm_Layout3x3_P1.26mm_ManualAssemblyLFCSP-72-1EP_10x10mm_P0.5mm_EP5.3x5.3mmST_WLCSP-115_4.63x4.15mm_Layout21x11_P0.4mm_StaggerAnalog_LFCSP-UQ-10_1.3x1.6mm_P0.4mmST_WLCSP-143_Die449ST_WLCSP-27_2.34x2.55mm_Layout9x6_P0.4mm_Stagger